Engineered Conductive Materials, LLC, a leading global supplier of conductive interconnect materials for photovoltaic applications, debuts the fast curing conductive adhesive DB-1590 for use as a solder replacement in next-generation crystalline silicon solar modules using thinned silicon and/or plated bus bars. This material formulation has been optimized for excellent conductivity and stability on various substrates when cured at 200°C.
DB-1590 is designed to gel in five seconds or less at 200°C, developing sufficient strength to withstand the applied stresses induced by the manufacturing process until the adhesive cure is completed during the encapsulant lamination process. DB-1590 has optimized rheology for dispensing, excellent damp heat resistance and conductivity stability on tin, tin-silver and silver-plated ribbons. DB-1590 also is stable on OSP treated copper and nickel bus bars. The DB-1590 features a rubber-like flexibility that is ideal for flexible photovoltaic applications.
DB-1590 is the latest addition to Engineered Conductive Materials’ full line of conductive stringer attach adhesives, conductive adhesives for back contact crystalline silicon, thin-film and via fill applications, as well as conductive grid inks for photovoltaic applications.